FOREWORD BY CONFERENCE CO-CHAIR

被引:0
|
作者
Anuar, Khairil
机构
来源
15th IEEE Malaysia International Conference on Communications: Emerging Technologies in IoT and 5G, MICC 2021 - Proceedings | 2021年
关键词
D O I
10.1109/MICC53484.2021.9642069
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [31] Message from the Co-Chair
    Ciampi, Melany M.
    EDUNINE 2019 - 3rd IEEE World Engineering Education Conference: Modern Educational Paradigms for Computer and Engineering Career, Proceedings, 2019,
  • [32] Preface: General Co-Chair
    Abdullah, Rosni
    ICIT 2017 - 8th International Conference on Information Technology, Proceedings, 2017,
  • [33] Message from the Co-Chair
    Santos, Henrique
    EDUNINE 2020 - 4th IEEE World Engineering Education Conference: The Challenges of Education in Engineering, Computing and Technology without Exclusions: Innovation in the Era of the Industrial Revolution 4.0, Proceedings, 2020,
  • [34] Welcome message from Wun-Yan Chen, Conference Co-Chair
    Chen, Wun-Yan
    2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings, 2014,
  • [35] Welcome Message from Ming-Yi Tsai, Conference Co-Chair
    Tsai, Ming-Yi
    Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2019, 2019-October
  • [36] Welcome Message from Wei-Chung Lo, Conference Co-Chair
    Lo, Wei-Chung
    Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2022, 2022-October
  • [37] Welcome Message from Shen-Li Fu, Conference Co-Chair
    Fu, Shen-Li
    Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2020, 2020-October
  • [38] Welcome Message from Chih-I Wu, Conference Co-Chair
    Wu, Chih-I
    Wu, Chih-I, 1600, IEEE Computer Society (2021-December):
  • [39] Welcome Message from Wei-Chung Lo, Conference Co-Chair
    Lo, Wei-Chung
    Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2021, 2021-December
  • [40] Welcome message from Ming-Yi Tsai, conference co-chair
    Tsai, Ming-Yi
    Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2019, 2018-October