Mechanical properties of Sn-Bi-Ag low-temperature Pb-free solders

被引：0
|
作者：
Yang, Chih-Han [1 ]
Liu, Yu-Chen [1 ,2 ]
Hirata, Yuki [3 ]
Nishikawa, Hiroshi [3 ]
Lin, Shih-Kang [1 ,2 ,4 ]
机构：
[1] National Cheng Kung University, Department of Materials Science and Engineering, Tainan,70101, Taiwan
[2] National Cheng Kung University, Hierachical Green-Energy Materials (Hi-GEM) Research Center, Tainan,70101, Taiwan
[3] Osaka University, Joining and Welding Research Institute, Osaka,567-0047, Japan
[4] National Cheng Kung University, Center for Micro/Nano Science and Technology, Tainan,70101, Taiwan
来源：
2022 International Conference on Electronics Packaging, ICEP 2022 | 2022年
关键词：
Compendex;
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学科分类号：
摘要：
Lead-free solders
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页码：37 / 38
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