共 50 条
- [41] Welcome message from Simon Chen, conference Co-chair Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2011,
- [42] Welcome from the ESTC 2022 Technical Program Co-Chair 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings, 2022,
- [43] Welcome Message from Scott Chen, Conference Co-Chair Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2023,
- [44] Welcome message from co-chair of WPMC steering board International Symposium on Wireless Personal Multimedia Communications, WPMC, 2018, 2017-December
- [45] Welcome Message from Maurice Lee, Conference Co-Chair Lee, Maurice, 1600, IEEE Computer Society (2021-December):
- [46] Welcome message from Simon Chen, conference co-chair International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings, 2010,
- [48] Welcome Message from Maurice Lee, Conference Co-Chair Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2019, 2019-October
- [49] Welcome message from Rick Wu, conference co-chair Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2013,
- [50] Welcome message from Rick Wu, conference co-chair Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2019, 2018-October