3D reconstruction technology of SMT solder joint by shape from shading based on improved illumination model

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作者
Zhao, Huihuang [1 ]
Zhou, Dejian [2 ,3 ]
Huang, Chunyue [3 ]
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[1] School of Mechanical and Electronical Engineering, Xidian University, Xi'an 710071, China
[2] Department of Mechanical Engineering, Guangxi University of Technology, Liuzhou 545006, China
[3] School of Mechanical and Electronical Engineering, Guilin University of Electronic Technology, Guilin 541004, China
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页码:77 / 80
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