Heat spreading resistance model for anisotropic thermal conductivity materials in electronic packaging

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作者：
Ying, T.M. [1 ]
Toh, K.C. [1 ]
机构：
[1] Nanyang Technological Univ, Singapore
来源：
Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference | 2000年 / 1卷
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页码：314 / 321
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