Effect of gallium addition on microstructure and properties of Ag-Cu-Zn-Sn alloys

被引:0
|
作者
Ma, Jia [1 ]
Long, Weimin [1 ]
He, Peng [2 ]
Bao, Li [1 ]
Xue, Peng [3 ]
Wu, Mingfang [4 ]
机构
[1] State Key Laboratory of Advanced Brazing Filler Metals and Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou, China
[2] State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, China
[3] College of Material Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing, China
[4] School of Materials Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang, China
来源
China Welding (English Edition) | 2015年 / 24卷 / 03期
关键词
This project was co-funded by the European Regional Development Fund ( FEDER ); through the Portugal-2020 program (PT2020); under the Centre’s Regional Operational Program ( CENTRO-01-0145-FEDER-028699 ); and by the Portuguese Foundation for Science and Technology / MCTES through national funds ( PIDDAC ). Stephanie Alves and Fabiana Monteiro were supported by a doctoral grant from the Portuguese Foundation for Science and Technology ( SFRH/BD/102717/2014 and SFRH/BD/115585/2016; respectively);
D O I
暂无
中图分类号
学科分类号
摘要
22
引用
收藏
页码:6 / 10
相关论文
共 50 条
  • [31] Effects of Mn addition on the microstructure and mechanical properties of Mg–Zn–Sn alloys
    Hou, Caihong
    Qi, Fugang
    Ye, Zhisong
    Zhao, Nie
    Zhang, Dingfei
    Ouyang, Xiaoping
    Materials Science and Engineering: A, 2021, 774
  • [32] Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys
    Reid, M.
    Punch, J.
    Collins, M.
    Ryan, C.
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2008, 20 (04) : 3 - 8
  • [33] Effects of small addition of Ag and/or Cu on the microstructure and properties of Sn-9Zn lead-free solders
    El-Daly, A. A.
    Hammad, A. E.
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2010, 527 (20): : 5212 - 5219
  • [34] Effects of Ga addition on microstructure and properties of Sn-Ag-Cu/Cu solder joints
    Zhang, Q. K.
    Long, W. M.
    Yu, X. Q.
    Pei, Y. Y.
    Qiao, P. X.
    JOURNAL OF ALLOYS AND COMPOUNDS, 2015, 622 : 973 - 978
  • [35] EFFECT OF SN COMPONENT ON PROPERTIES AND MICROSTRUCTURE CU-NI-SN ALLOYS
    Nguyen, D. N.
    Hoang, A. T.
    Pham, X. D.
    Sai, M. T.
    Chau, M. Q.
    Pham, V. V.
    JURNAL TEKNOLOGI, 2018, 80 (06): : 43 - 52
  • [36] Effect of Zn on the shear properties of Sn0.5Ag0.7Cu/Cu joints and the microstructure of aging joints
    Zhang M.
    Zhu Z.
    Xu H.
    Wang G.
    Du M.
    Wang B.
    Hanjie Xuebao/Transactions of the China Welding Institution, 2021, 42 (05): : 57 - 64
  • [37] Effects of gallium on wettability, microstructures and mechanical properties of the Sn-Zn-Ag-Ga and Sn-Zn-Ag-Al-Ga solder alloys
    Chen, KI
    Lin, KL
    PROCEEDINGS OF THE 4TH INTERNATIONAL SYMPOSIUM ON ELECTRONIC MATERIALS AND PACKAGING, 2002, : 49 - 54
  • [38] Effect of cooling rate on microstructure of Ag-Cu-Sn solder alloys
    Snugovsky, L
    Snugovsky, P
    Perovic, DD
    Rutter, JW
    MATERIALS SCIENCE AND TECHNOLOGY, 2005, 21 (01) : 61 - 68
  • [39] Effect of Ag addition on the microstructure and corrosion properties of Sn-9Zn lead-free solder
    Pu, Cunji
    Li, Caiju
    Dong, Tinghao
    Miao, Yingde
    Gao, Peng
    Zhang, Xin
    Peng, Jubo
    Yi, Jianhong
    JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2023, 27 : 6400 - 6411
  • [40] Effects of Sn addition on microstructure and mechanical properties of Mg-Zn-Al alloys
    Wang, Bo
    Chen, Xianhua
    Pan, Fusheng
    Mao, Jianjun
    PROGRESS IN NATURAL SCIENCE-MATERIALS INTERNATIONAL, 2017, 27 (06) : 695 - 702