Control of 3D IC process steps by optical metrologies

被引：0
|
作者：
Fresquet, G. [1 ]
Le Cunff, D. [2 ]
Raymond, Th. [3 ]
De Vries, D.K. [3 ]
机构：
[1] Fogale Nanotech, France
[2] STMicroelectronics, France
[3] Qualtera, France
来源：
Advancing Microelectronics | 2016年 / 43卷 / 02期
关键词：
6;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：28 / 33
相关论文
共 50 条
  • [1] 3D IC Process integration challenges and solutions
    Powell, Kevin
    Burgess, Stephen
    Wilby, Tony
    Hyndman, Rhonda
    Callahan, John
    PROCEEDINGS OF THE IEEE 2008 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2008, : 40 - +
  • [2] Use of Optical Metrology Techniques for Uniformity Control of 3D Stacked IC's
    Le Cunff, D.
    Tardif, M.
    Hotellier, N.
    Le Chao, K.
    Chapelon, L. L.
    Bar, P.
    Eynard, S.
    Piel, J. P.
    Fresquet, G.
    2014 25TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC), 2014, : 62 - 66
  • [3] Co-process Technology of the TSV and Embedded IC for 3D heterogeneous IC Integration
    Yook, Jong-Min
    Kim, Seong-Ryul
    Lee, Won-Cheol
    Kim, Dong-Su
    Kim, Jun-Chul
    2015 IEEE 17TH ELECTRONICS PACKAGING AND TECHNOLOGY CONFERENCE (EPTC), 2015,
  • [4] Process Development to Enable Die Sorting and 3D IC Stacking
    La Manna, A.
    Daily, R.
    Capuz, G.
    De Vos, J.
    Rebibis, K.
    Bogaerts, L.
    Miller, A.
    Beyne, E.
    PROCEEDINGS OF THE 2012 IEEE 14TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2012, : 311 - 315
  • [5] 3D laser metal deposition: process steps for additive manufacturing
    Graf, B.
    Marko, A.
    Petrat, T.
    Gumenyuk, A.
    Rethmeier, M.
    WELDING IN THE WORLD, 2018, 62 (04) : 877 - 883
  • [6] 3D laser metal deposition: process steps for additive manufacturing
    B. Graf
    A. Marko
    T. Petrat
    A. Gumenyuk
    M. Rethmeier
    Welding in the World, 2018, 62 : 877 - 883
  • [7] IC Packaging: 3D IC Technology and Methods
    Kumar, Adesh
    Verma, Gaurav
    Nath, Vijay
    Choudhury, Sushabhan
    PROCEEDINGS OF THE INTERNATIONAL CONFERENCE ON NANO-ELECTRONICS, CIRCUITS & COMMUNICATION SYSTEMS, 2017, 403 : 303 - 317
  • [8] Optical 3D shape measurement for dynamic process
    Su X.-Y.
    Zhang Q.-C.
    Xiang L.-Q.
    Optoelectron. Lett., 2008, 1 (55-58): : 55 - 58
  • [9] Optical 3D shape measurement for dynamic process
    SU Xian-yu
    OptoelectronicsLetters, 2008, (01) : 55 - 58
  • [10] Architecture of 3D Memory Cell Array on 3D IC
    Lee, Sang-Yun
    Park, Junil
    2012 4TH IEEE INTERNATIONAL MEMORY WORKSHOP (IMW), 2012,
12345