Pad conditioning in chemical mechanical polishing: A conditioning density distribution model to predict pad surface shape

被引：0
|
作者：
Baisie, Emmanuel A. [1 ]
Li, Zhichao [1 ]
Zhang, Xiaohong [2 ]
机构：
[1] Department of Industrial and Systems Engineering, North Carolina Agricultural and Technical State University, 1601 E. Market Street, Greensboro, NC 27411, United States
[2] Seagate Technology, 1 Disc Drive, Bloomington, Minneapolis, MN 55435, United States
来源：
International Journal of Manufacturing Research | 2013年 / 8卷 / 01期
关键词：
Chemical mechanical polishing;
D O I：
10.1504/IJMR.2013.051836
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：103 / 119
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