共 50 条
- [21] Complete solder paste printing process - Part 2 Surface mount technology, 1997, 11 (06): : 58 - 62
- [23] EXAMINATION OF CONVECTION/INFRARED SM REFLOW SOLDERING - PART 2. SMT Surface Mount Technology Magazine, 1987, 1 (02): : 13 - 15
- [24] UNDERSTANDING THE CONTROLS NECESSARY FOR WAVE SOLDERING RELIABILITY - PART 2. Electronic Manufacturing, 1988, 34 (08): : 35 - 36
- [25] Soldering with SACX0307-(TiO2/ZnO) nano-composite solder alloys 2021 44TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE), 2021,
- [26] Effects of TiO2 nanoparticles addition on physical and soldering properties of Sn–xTiO2 composite solder Journal of Materials Science: Materials in Electronics, 2019, 30 : 18828 - 18837
- [29] Quasi-static modeling of the selfalignment mechanism in flip-chip soldering. Part I. Single solder joint Patra, S.K., 1600, (113):