Design for manufacture analysis based on printed circuit board

被引:0
|
作者
Huang, Zhan-Wu [1 ]
Li, Zhi-Juan [1 ]
Jiang, Jian-Guo [1 ]
Ye, Qiang [1 ]
Cao, Yu [1 ]
机构
[1] Xidian Univ., Xi'an 710071, China
关键词
Electronics packaging - Integrated circuit layout - Surface mount technology;
D O I
暂无
中图分类号
TN3 [半导体技术]; TN4 [微电子学、集成电路(IC)];
学科分类号
0805 ; 080501 ; 080502 ; 080903 ; 1401 ;
摘要
In view of the definition of design for manufacture (DFM) and the valor software trilogy 5000 this paper explained the necessity of the DFM of printed circuit board (PCB). The standard of choosing components which will be on the PCB and the principle with which Mark following is set up were simply introduced. The size of pad and the principle of setting up PCB layer and the rules of the layout design and the track, as setting up PCB following with, were described. The footprint of familiar SMT, the space between the components and the local hole, and the minimum distance between the track and pad, as well as the track and via, the via and the pad were also introduced.
引用
收藏
页码:91 / 94
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