共 50 条
- [41] Reliability assessment of transfer molded CSP Proceedings of the Electronic Packaging Technology Conference, EPTC, 1998, : 274 - 278
- [42] Effect of filler settling of underfill encapsulant on reliability performance INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, PROCEEDINGS, 2001, : 218 - 223
- [45] Board level reliability for laminate CSP TWENTY THIRD IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, 1998, : 315 - 322
- [46] Mechanical reliability of CSP mounted on PWB NEC RESEARCH & DEVELOPMENT, 2001, 42 (04): : 388 - 393
- [47] Rework and reliability of underfilled CSP assemblies 52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, : 458 - 466