Optimized flip-chip interconnect for 38 GHz thin-film microstrip multichip modules

被引：0
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作者：
Ferdinand-Braun-Inst fuer, Hoechstfrequenztechnik, Berlin, Germany [1 ]
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来源：
IEEE MTT-S International Microwave Symposium Digest | 2000年 / 1卷
关键词：
Carrier substrate - Electromagnetic simulation - Flip chip interconnect - Return loss;
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页码：69 / 72
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