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- [21] Board level reliability testing of μBGA® packaging with lead-free solder attachment PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, : 10 - 14
- [23] Lead-free semiconductor packaging PROCEEDINGS OF THE 4TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2002), 2002, : 11 - 19
- [25] Reliability of solder joints assembled with lead-free solder FUJITSU SCIENTIFIC & TECHNICAL JOURNAL, 2002, 38 (01): : 96 - 101
- [26] Designs of Temperature Loads on the Fatigue Life Analysis of Lead-Free Solder in IC Packages IMPACT: 2009 4TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE, 2009, : 373 - +
- [28] The status of lead-free solder alloys ADVANCED ELECTRONICS ASSEMBLY - A SYMPOSIUM ON LEAD FREE INTERCONNECT TECHNOLOGY, PROCEEDINGS OF THE TECHNICAL PROGRAM, 2000, : 36 - 41
- [29] Reliability of lead-free solder alloys ENVIRONMENT CONSCIOUS MATERIALS - ECOMATERIALS, 2000, : 703 - 715
- [30] Drop test reliability assessment of leaded & lead-free solder joints for IC packages 6TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS (EPTC 2004), 2004, : 210 - 217