Electrochemical investigation on the effect of silver addition on wettability of Sn-Zn system lead-free solder

被引:0
|
作者
Takemoto, Tadashi
Funaki, Tatsuya
Matsunawa, Akira
机构
来源
Welding Research Abroad | 2000年 / 46卷 / 02期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [21] An Investigation of Microstructure and Mechanical Properties of Different Nano - Particles Doped Sn-Zn Lead-Free Solder Alloys
    Ismail, R. Afify
    ARAB JOURNAL OF NUCLEAR SCIENCES AND APPLICATIONS, 2020, 53 (01): : 191 - 199
  • [22] Properties of Sn-Zn alloys as lead-free solders
    School of Materials Science and Engineering, Nanchang University, Nanchang 330031, China
    Zhongguo Youse Jinshu Xuebao, 2006, 12 (1993-1998):
  • [23] Reliability of solder paste and solder pre-coating technology by lead-free Sn-Zn base solder alloy
    Sakai, T
    Amita, H
    Shibuya, Y
    Kurozumi, T
    Nagasaki, S
    Shoji, T
    2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2000, 4339 : 293 - 302
  • [24] Wettability of Sn-Zn-Bi Based Lead-Free Solder with Rare Earths
    Zhang Jiangang
    Journal of Rare Earths, 2006, (05) : 632 - 632
  • [25] Effect of Zn Addition on Bulk Microstructure of Lead-free Solder SN100C
    Nadirah, Nur M. K.
    Nurulakmal, M. S.
    ADVANCED MATERIALS FOR SUSTAINABILITY AND GROWTH, 2017, 1901
  • [26] Ductile Damage Evolution Analysis of Lead-Free Sn-Zn Solder Based on Meso Topography
    Liu, Caiping
    Duan, Qingquan
    Mao, Lingtao
    NEW MATERIALS AND ADVANCED MATERIALS, PTS 1 AND 2, 2011, 152-153 : 1004 - +
  • [27] Effects of rare earth element Nd on the solderability and microstructure of Sn-Zn lead-free solder
    Hu, Yu-hua
    Xue, Song-bai
    Wang, Hui
    Ye, Huan
    Xiao, Zheng-xiang
    Gao, Li-li
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2011, 22 (05) : 481 - 487
  • [28] Coffin-Manson equation determination for Sn-Zn based lead-free solder joints
    Sun, Peng
    Andersson, Cristina
    Cheng, Zhaonian
    Lai, Zonghe
    Shangguan, Dongkai
    Liu, Johan
    PROCEEDINGS OF THE SEVENTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN, PACKAGING AND FAILURE ANALYSIS (HDP'05), 2005, : 342 - 347
  • [29] Investigation on properties of Sn-8Zn-3Bi lead-free solder by Nd addition
    Zhou, Jian
    Huang, Dan
    Fang, Yi-Li
    Xue, Feng
    JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 480 (02) : 903 - 907
  • [30] Microstructure and mechanical properties of Sn-Bi, Sn-Ag and Sn-Zn lead-free solder alloys
    Osorio, Wislei R.
    Peixoto, Leandro C.
    Garcia, Leonardo R.
    Mangelinck-Noel, Nathalie
    Garcia, Amauri
    JOURNAL OF ALLOYS AND COMPOUNDS, 2013, 572 : 97 - 106