Mechanics of finger-tip electronics

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机构：
[1] [1,Su, Yewang
[2] Li, Rui
[3] Cheng, Huanyu
[4] Ying, Ming
[5] Bonifas, Andrew P.
[6] Hwang, Keh-Chih
[7] Rogers, John A.
[8] Huang, Yonggang
来源：
Rogers, J.A. (jrogers@illinois.edu) | 1600年 / American Institute of Physics Inc.卷 / 114期
关键词：
Tactile sensors and electrotactile stimulators can provide important links between humans and virtual environments; through the sensation of touch. Soft materials; such as low modulus silicones; are attractive as platforms and support matrices for arrays sensors and actuators that laminate directly onto the fingertips. Analytic models for the mechanics of three dimensional; form-fitting finger cuffs based on such designs are presented here; along with quantitative validation using the finite element method. The results indicate that the maximum strains in the silicone and the embedded devices are inversely proportional to the square root of radius of curvature of the cuff. These and other findings can be useful in formulating designs for these and related classes of body-worn; three dimensional devices. © 2013 AIP Publishing LLC;
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