Integrated RF-MEMS technology for reconfigurable RF transceivers

被引：0

作者：

Kuwabara, Kei ^{[1
]}

Sato, Norio ^{[2
]}

Shimamura, Toshishige ^{[2
]}

Morimura, Hiroki ^{[2
]}

Kodate, Junichi ^{[3
]}

Ishii, Hiromu ^{[2
]}

机构：

[1] NTT Microsystem Integration Laboratories, Atsugi-shi, 243-0198, Japan

[2] Smart Devices Laboratory, NTT Microsystem Integration Laboratories

[3] MEMS Devices Research Group, Smart Devices Laboratory, NTT Microsystem Integration Laboratories

来源：

NTT Technical Review | 2007年 / 5卷 / 10期

关键词：

Electromechanical devices - MEMS - Space optics;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

This paper describes a novel structure and fabrication process for integrated RF-MEMS (radio frequency microelectromechanical systems) technology. This technology features a multilayer structure and an encapsulation process for the integration and protection of RF MEMS devices. Various types of encapsulated RF-MEMS devices, such as switches and varactors, were fabricated on the same substrate simultaneously. Experimental results indicate that this technology is promising for the development of small low-power reconfigurable RF transceivers.

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