Effects of adhesive layers on residual stress generated in copper foil of copper clad laminates

被引：0
|
作者：
Research Laboratory for Integrated Technological System, Kanazawa Institute of Technology, 3-1 Yatsukaho, Hakusan-shi, Ishikawa 924-0838, Japan [1 ]
不详 [2 ]
机构：
来源：
J. Jpn. Inst. Electron. Packag. | 2008年 / 7卷 / 529-534期
关键词：
D O I：
10.5104/jiep.11.529
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [41] Stress Measurement Using EBSD Analysis of Grains in Copper Foil
    Ono, Y.
    Morito, S.
    Li, C.
    EXPERIMENTAL MECHANICS, 2012, 52 (05) : 493 - 502
  • [42] Biaxial stress measurement by electrodeposited copper foil with circular holes
    Kitaoka, S
    Ono, Y
    STRAIN, 2006, 42 (01) : 49 - 56
  • [43] Stress relaxation and creep of 12 to 35 μm copper foil
    Merchant, HD
    CREEP AND STRESS RELAXATION IN MINIATURE STRUCTURES AND COMPONENTS, 1996, : 47 - 55
  • [44] Stress relaxation and creep of 12 to 35 μm copper foil
    H. D. Merchant
    Journal of Electronic Materials, 1997, 26 : 833 - 838
  • [45] Synergistic effects of gelatin and convection on copper foil electrodeposition
    Chang, Tingru
    Jin, Ying
    Wen, Lei
    Zhang, Chensheng
    Leygraf, Christofer
    Wallinder, Inger Odnevall
    Zhang, Junping
    ELECTROCHIMICA ACTA, 2016, 211 : 245 - 254
  • [46] Development of non-adhesive type flexible copper clad laminate "UPISEL®-N"
    Yamaguchi, H
    JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY, 2003, 16 (02) : 233 - 236
  • [47] Effect of laminating parameters on the adhesion property of flexible copper clad laminate with adhesive layer
    Noh, Bo-In
    Yoon, Jeong-Won
    Jung, Seung-Boo
    INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2010, 30 (01) : 30 - 35
  • [48] Effects of organic additives on preferred plane and residual stress of copper electroplated on polyimide
    Kim, Jongsoo
    Kim, Heesan
    MATERIALS CHEMISTRY AND PHYSICS, 2010, 120 (2-3) : 341 - 347
  • [49] Effects of nodule treatment of rolled copper on the mechanical properties of the flexible copper-clad laminate
    Lee, Chang-Yong
    Lee, Jae-Hong
    Choi, Don-Hyun
    Lee, Hoo-Jeong
    Kim, Hyoung-Sub
    Jung, Seung-Boo
    Moon, Won-Chul
    MICROELECTRONIC ENGINEERING, 2007, 84 (11) : 2653 - 2657
  • [50] Novolac cured epoxy resin/fullerene modified clay composites: applied to copper clad laminates
    Tsai, Tsung-Yen
    Bunekar, Naveen
    Huang, Chun-Chieh
    Huang, Yu-Shan
    Chen, Li-Chun
    RSC ADVANCES, 2015, 5 (116) : 95649 - 95656
12345