Effects of adhesive layers on residual stress generated in copper foil of copper clad laminates

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Research Laboratory for Integrated Technological System, Kanazawa Institute of Technology, 3-1 Yatsukaho, Hakusan-shi, Ishikawa 924-0838, Japan [1 ]
不详 [2 ]
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J. Jpn. Inst. Electron. Packag. | 2008年 / 7卷 / 529-534期
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10.5104/jiep.11.529
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