High thermally conductive polyimide film designed with heterostructural Cring-C3N4 filler and multilayer strategy

被引：0
|
作者：
Chen, Xi [1 ,2 ]
Wang, Yanyan [2 ]
Zheng, Kang [2 ]
Xiao, Chao [2 ]
Xue, Meng [3 ]
Chen, Lin [2 ]
Gong, Yi [2 ]
Tian, Xingyou [2 ]
Zhang, Xian [2 ]
机构：
[1] Institutes of Physical Science and Information Technology, Anhui University, Anhui, Hefei,230601, China
[2] Key Lab of Photovoltaic and Energy Conservation Materials, Institute of Solid State Physics, HFIPS, Chinese Academy of Sciences, Hefei,230031, China
[3] Guangdong Banggu Film Coatings Innovation Academy Co., Ltd., Nanxiong,512400, China
来源：
Journal of Alloys and Compounds | 1600年 / 983卷
关键词：
This work was financially supported by the National Natural Science Foundation of China (No. U21A2094 ); CASHIPS Director’s Fund ( YZJJZX202015; YZJJ202304-CX; YZJJ2023QN36 ). Anhui Province Postdoctoral Researcher Research Project ( E24F0D27 ); Central Government Guiding Local Government Science and Technology Development Special Fund Project (No. 2022ZB09002 );
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摘要：
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