IP and Motorola readying `smart chips' for packaging

被引:0
|
作者
Anon
机构
来源
Walden's North American Pulp Paper Report | 2000年 / 2卷 / 13期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [31] IP sells Flexible Packaging business
    Walden's Paper Report, 2001, 31 (16):
  • [32] IP completes acquisition of Shorewood Packaging
    Anon
    Walden's Paper Report, 2000, 30 (07):
  • [33] MEMS Packaging IP and Market Status
    Bauer, C. E.
    Fillion, R. A.
    Neuhaus, H. J.
    Papageorge, Marc
    IMPACT: 2009 4TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE, 2009, : 267 - +
  • [34] IP shutting two packaging plants
    Anon
    Walden's Paper Report, 2000, 30 (09):
  • [35] Smart Tool for Integrated Chips Selection
    Pillay, Anusha
    Sharma, Kartik
    Subashini, Monica M.
    2013 INTERNATIONAL CONFERENCE ON INFORMATICS, ELECTRONICS & VISION (ICIEV), 2013,
  • [36] ASIC chips and their integration to smart devices
    Ramalingam, N
    Varadan, VK
    Varadan, VV
    SMART ELECTRONICS AND MEMS - SMART STRUCTURES AND MATERIALS 1997, 1997, 3046 : 260 - 272
  • [37] The Active, Smart Future of Packaging
    Dunn, Thomas
    FOOD TECHNOLOGY, 2015, 69 (09) : 118 - 121
  • [38] Smart food packaging films
    Guo, Yufang
    NATURE FOOD, 2021, 2 (09): : 641 - 641
  • [39] SMART PACKAGING FOR FOOD PRESERVATION
    Rodriguez-Sauceda, Raquel
    Rojo-Martinez, Gustavo E.
    Martinez-Ruiz, Rosa
    Pina-Ruiz, Hugo H.
    Ramirez-Valverde, Benito
    Vaquera-Huerta, Humberto
    Cong-Hermida, Milagros de la C.
    REVISTA RA XIMHAI, 2014, 10 (06): : 151 - 173
  • [40] Smart Packaging for Security and Logistics
    Simske, Steven J.
    DIGITAL FABRICATION 2011/ NIP27- 27TH INTERNATIONAL CONFERENCE ON DIGITAL PRINTING TECHNOLOGIES: TECHNICAL PROGRAMS AND PROCEEDINGS, 2011, 2011, : 801 - 804