IP and Motorola readying `smart chips' for packaging

被引:0
|
作者
Anon
机构
来源
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [1] IP and Motorola introduce `smart packaging'
    Anon
    Walden's Paper Report, 2000, 30 (09):
  • [2] IP & Motorola get smart
    Anon
    Official Board Markets, 2000, 76 (17):
  • [3] Motorola picks Lucent chips
    不详
    EDN, 1997, 42 (11) : S8 - S8
  • [4] Packaging and wired interconnections for insertion of miniaturized chips in smart fabrics
    Brun, Jean
    Vicard, Dominique
    Mourey, Bruno
    Lepine, Benoit
    Frassati, Francois
    2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2, 2009, : 40 - 44
  • [5] MOTOROLA SEES PAYOFF IN MERCHANT VHSIC CHIPS
    WALLER, L
    ELECTRONICS, 1985, 58 (48): : 19 - 20
  • [6] Packaging MEMS inertial sensors at Motorola
    Li, G
    Mahadevan, D
    Chapman, M
    2003 IEEE LEOS ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS 1 AND 2, 2003, : 628 - 629
  • [7] Motorola licenses micro SMT packaging
    Electronic Design, 1995, 43 (25):
  • [8] Siemens, Motorola unveil chips on 300 mm wafers
    不详
    CONTROL ENGINEERING, 1999, 46 (03) : 2 - 2
  • [9] MOTOROLA MAKES MOVE IN SMART POWER
    GEE, J
    ELECTRONICS-US, 1993, 66 (05): : 9 - 9
  • [10] Test Chips For Advanced Packaging
    Reinert, Wolfgang
    Kahler, Dirk
    2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, : 325 - 327