Influence of growth rate and magnetic field on microstructure and properties of directionally solidified Ag-Cu eutectic alloy

被引：0

作者：

Zuo X. ^{[1
,2
]}

Zhao C. ^{[1
,3
]}

Zhang L. ^{[1
,2
]}

Wang E. ^{[1
,2
]}

机构：

[1] Key Laboratory of Electromagnetic Processing of Materials (Ministry of Education), Northeastern University, Shenyang

[2] School of Metallurgy, Northeastern University, Shenyang

[3] School of Materials Science and Engineering, Northeastern University, Shenyang

来源：

Zuo, Xiaowei (zuoxw@epm.neu.edu.cn) | 2016年 / MDPI AG卷 / 09期

基金：

中国国家自然科学基金; 美国国家科学基金会; 高等学校博士学科点专项科研基金;

关键词：

Ag-Cu eutectic alloy; Eutectic lamellar spacing; Growth rate; Magnetic field; Microhardness; Strength;

D O I：

10.3390/MA9070569

中图分类号：

学科分类号：

摘要：

We report the influence of growth rate and external magnetic field on the eutectic lamellar spacing and properties of directionally-solidified Ag-Cu eutectic alloys. The results indicated that the relationship between the lamellar spacing of directionally-solidified Ag-Cu alloys and the growth rate matched the prediction of the Jackson-Hunt model, and the constant was 5.8 μm3/s. The increasing external magnetic field during solidification tilted the growth direction of the lamellar eutectics, and coarsened the eutectic lamellar spacing. These decreased the microhardness and strength of Ag-Cu alloys, but increased their electrical conductivity. The competitive strengthening contributions between the refinement of the eutectic lamellar spacing and the change in growth direction of the eutectics resulted in higher strength in the as-rolled sample with a 0.8 T magnetic field than with other samples, which was confirmed from higher relieved deformation energy using differential scanning calorimetry.

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