Life prediction of ball grid array soldered joints under thermal cycling loading by fracture mechanics method

被引：0
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作者：
Fang, H.Y. [1 ]
Wang, L. [1 ]
Qian, Y.Y. [1 ]
机构：
[1] Harbin Inst. of Technol., Harbin 150001, China
来源：
Journal of Materials Science and Technology | 2001年 / 17卷 / 01期
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页码：165 / 166
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