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- [21] Vibration fatigue reliability of BGA-IC package with pb-free solder and Pb-Sn solder 53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 891 - 897
- [22] Improvement of mechanical impact resistance of BGA packages with Pb-free solder bumps EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2006, : 174 - 178
- [23] Solder joint strengths and interfacial reactions in various PB-free solder joints 2007 INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE, PROCEEDINGS OF TECHNICAL PAPERS, 2007, : 58 - +
- [24] Effects of UBM thickness in electromigration on Pb-free solder joints 54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 998 - 1002
- [25] Effects of electromigration on IMC evolution in Pb-free solder joints 2004 INTERNATIONAL CONFERENCE ON THE BUSINESS OF ELECTRONIC PRODUCT RELIABILITY AND LIABILITY, PROCEEDINGS, 2004, : 47 - 49
- [27] The Influence of Processing on Strengthening Mechanisms in Pb-Free Solder Joints Journal of Electronic Materials, 2017, 46 : 2067 - 2079
- [28] Effect of flux quantity on Sn-Pb and Pb-free BGA solder shear strength TWENTY SEVENTH ANNUAL IEEE/CPMT/SEMI INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, 2002, : 229 - 237
- [29] The Effect of Improper Conformal Coating on SnPb and Pb-free BGA Solder Joints during Thermal Cycling: Experiments and Modeling 2017 THIRTY-THIRD ANNUAL SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM (SEMI-THERM), 2017, : 40 - 47