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- [2] Reliability of Pb-free BGA solder joints under random vibration 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 1151 - 1155
- [3] A study of electromigration failure in Pb-free solder joints 2005 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 43RD ANNUAL, 2005, : 518 - 523
- [5] A component level test method for evaluating the resistance of Pb-free BGA solder joints to brittle fracture under shock impact 57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 1522 - +
- [8] Influence of shear speed on the shear force of eutectic Sn-Pb and Pb-free BGA solder joints DESIGNING, PROCESSING AND PROPERTIES OF ADVANCED ENGINEERING MATERIALS, PTS 1 AND 2, 2004, 449-4 : 897 - 900
- [9] Powercycling reliability, failure analysis and acceleration factors of Pb-free solder joints 55TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2005 PROCEEDINGS, 2005, : 907 - 915
- [10] Effect of voids on thermo-mechanical durability of Pb-free BGA solder joints: Modeling and simulation ELECTRONIC AND PHOTONIC PACKAGING, INTEGRATION AND PACKAGING OF MICRO/NANO/ELECTRONIC SYSTEMS, 2005, : 57 - 63