Resource-efficient bonding and casting technologies in electronics manufacturing

被引：0
|
作者：
Steinmetzer K. [1 ]
Piller S. [1 ]
Schmitt S. [1 ]
机构：
[1] Scheugenpflug GmbH, Neustadt
来源：
Adhaesion Kleben und Dichten | 2022年 / 66卷 / 05期
关键词：
D O I：
10.1007/s35145-022-0588-9
中图分类号：
学科分类号：
摘要：
[No abstract available]
引用
收藏
页码：16 / 21
页数：5
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