共 50 条
- [11] Effect of solder ball pad design on cavity down BGA solder joint reliability 52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, : 1001 - 1006
- [12] Shear strength analysis of ball grid array (BGA) solder interfaces 2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2007, : 770 - +
- [14] Ball Grid Array (BGA) packages with the copper core solder balls 48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS, 1998, : 692 - 701
- [15] Mechanical strength test method for solder ball joint in BGA package Metals and Materials International, 2005, 11 : 121 - 129
- [16] The effect of ball pad metallurgy and ball composition on solder ball integrity of plastic ball grid array packages ISTFA '98: PROCEEDINGS OF THE 24TH INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS, 1998, : 405 - 411
- [17] Ball Grid Array (BGA) solder joint intermittency detections: SJ BIST 2008 IEEE AEROSPACE CONFERENCE, VOLS 1-9, 2008, : 3847 - +
- [18] Investigation of Wetting Behavior of Sn-3Ag-0.5Cu Solder Paste to BGA Solder Ball 2012 35TH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM (IEMT), 2012,
- [20] A study on oval type solder ball land for high density BGA package applications 2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2000, 4339 : 788 - 795