共 50 条
- [1] Investigation on Cracked Solder Ball of BGA Component 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 720 - 724
- [3] Influence of nodulizer type on quality of BGA solder ball Hanjie Xuebao/Transactions of the China Welding Institution, 2010, 31 (04): : 109 - 112
- [4] Solder Ball Robustness Study on Polymer Core Solder Balls for BGA Packages 2012 35TH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM (IEMT), 2012,
- [5] Varied Ball BGA Technology to Eliminate Solder Ball Bridging Defects in SMT 2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 1259 - 1264
- [7] Ball grid array (BGA) solder joint integrity enhancement ELECTRO 98 - PROFESSIONAL PROGRAM PROCEEDINGS, 1998, : 37 - 44
- [9] Investigations of Solder Ball Drop Reliability: BGA versus WLP 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 626 - 631
- [10] Evaluations of the BGA solder ball shape by using energy method CMC-COMPUTERS MATERIALS & CONTINUA, 2007, 6 (01): : 43 - 50