Microstructure of interface between Ag-Cu-Ti brazing filler metal and diamond

被引：0
|
作者：
Lu, Jinbin [1 ,2 ]
Xu, Jiuhua [2 ]
机构：
[1] School of Materials and Chemical Engineering, Zhongyuan University of Technology, Zhengzhou 450007, China
[2] Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
来源：
Hanjie Xuebao/Transactions of the China Welding Institution | 2007年 / 28卷 / 08期
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页码：29 / 32
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