Materials for high-temperature digital electronics

被引：0
|
作者：
Pradhan, Dhiren K. [1 ]
Moore, David C. [2 ]
Francis, A. Matt [3 ]
Kupernik, Jacob [3 ]
Kennedy, W. Joshua [2 ]
Glavin, Nicholas R. [2 ]
Olsson, Roy H. [1 ]
Jariwala, Deep [1 ]
机构：
[1] Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia,PA, United States
[2] Materials and Manufacturing Directorate, Air Force Research Laboratory, Wright-Patterson AFB, Dayton,OH, United States
[3] Ozark Integrated Circuits, Fayetteville,AR, United States
来源：
Nature Reviews Materials | 2024年 / 9卷 / 11期
关键词：
Compendex;
D O I：
10.1038/s41578-024-00731-9
中图分类号：
学科分类号：
摘要：
Semiconductor device manufacture
引用
收藏
页码：790 / 807
页数：17
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