Materials for high-temperature digital electronics

被引：0

作者：

Pradhan, Dhiren K. ^{[1
]}

Moore, David C. ^{[2
]}

Francis, A. Matt ^{[3
]}

Kupernik, Jacob ^{[3
]}

Kennedy, W. Joshua ^{[2
]}

Glavin, Nicholas R. ^{[2
]}

Olsson, Roy H. ^{[1
]}

Jariwala, Deep ^{[1
]}

机构：

[1] Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia,PA, United States

[2] Materials and Manufacturing Directorate, Air Force Research Laboratory, Wright-Patterson AFB, Dayton,OH, United States

[3] Ozark Integrated Circuits, Fayetteville,AR, United States

来源：

Nature Reviews Materials | 2024年 / 9卷 / 11期

关键词：

Compendex;

D O I：

10.1038/s41578-024-00731-9

中图分类号：

学科分类号：

摘要：

Semiconductor device manufacture

引用

页码：790 / 807

页数：17

共 50 条

[1] Publisher Correction: Materials for high-temperature digital electronics
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