Remote NF3 plasma processes for CVD chamber cleans

被引:0
|
作者
Lester, M.A.
机构
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [41] Microwave plasma torch abatement of NF3 and SF6
    Hong, YC
    Uhm, HS
    Chun, BJ
    Lee, SK
    Hwang, SK
    Kim, DS
    PHYSICS OF PLASMAS, 2006, 13 (03)
  • [42] PLASMA AND REAGENT PULSE INDUCED TRANSIENTS IN THE ETCHING OF SI BY NF3
    ISHII, I
    BRANDT, WW
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1986, 133 (06) : 1240 - 1242
  • [43] Influence of the electron kinetics on Ar/NF3 inductively coupled plasma
    Levko, Dmitry
    Raja, Laxminarayan L.
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2022, 40 (04):
  • [44] Thin layer etching of silicon nitride: A comprehensive study of selective removal using NH3/NF3 remote plasma
    Posseme, N.
    Ah-Leung, V.
    Pollet, O.
    Arvet, C.
    Garcia-Barros, M.
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2016, 34 (06):
  • [45] Cyclic etching of silicon oxide using NF3/H2 remote plasma and NH3 gas flow
    Gill, You Jung
    Kim, Doo San
    Gil, Hong Seong
    Kim, Ki Hyun
    Jang, Yun Jong
    Kim, Ye Eun
    Yeom, Geun Young
    PLASMA PROCESSES AND POLYMERS, 2021, 18 (11)
  • [46] Effects of type of reactor, crystallinity of SiC, and NF3 gas pressure on etching rate and smoothness of SiC surface using NF3 gas plasma
    Tasaka, A.
    Yamada, H.
    Nonoyama, T.
    Kanatani, T.
    Kotaka, Y.
    Tojo, T.
    Inaba, M.
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2009, 27 (06): : 1369 - 1376
  • [47] Unveiling the Influence of Water Molecules for NF3 Removal by the Reaction of NF3 with OH: A DFT Study
    Liu, Jiaxin
    Zhao, Yong
    Lian, Xueqi
    Li, Dongdong
    Zhang, Xueling
    Chen, Jun
    Deng, Bin
    Lan, Xiaobing
    Shao, Youxiang
    MOLECULES, 2024, 29 (17):
  • [48] MASS-SPECTROMETRIC STUDY OF NF3 PLASMA-ETCHING OF SILICON
    PERRIN, J
    MEOT, J
    SIEFERT, JM
    SCHMITT, J
    PLASMA CHEMISTRY AND PLASMA PROCESSING, 1990, 10 (04) : 571 - 587
  • [49] Remote plasma clean technology for dielectric CVD chamber cleaning to reduce PFC emissions
    Mendicino, L
    Brown, PT
    Filipiak, S
    Loop, D
    Basnett, R
    Holber, W
    Pearce, R
    Johnson, A
    ENVIRONMENTAL ISSUES IN THE ELECTRONICS AND SEMICONDUCTOR INDUSTRIES, 1999, 99 (08): : 40 - 51
  • [50] Surface treatment of SiC using NF3/O2 plasma
    Kai, T
    Shimizu, W
    Hibi, A
    Iwase, T
    Abe, T
    Inaba, M
    Ogumi, Z
    Tojo, T
    Tasaka, A
    PLASMA PROCESSING XIV, 2002, 2002 (17): : 84 - 91