Development of a multilayer SiC surface micromachining process with capabilities and design rules comparable to conventional polysilicon surface micromachining

被引：0
|
作者：
Song, X. [1 ]
Rajgopal, S. [2 ]
Melzak, J.M. [2 ]
Zorman, C.A. [1 ]
Mehregany, M. [1 ]
机构：
[1] Department of Electrical Engineering and Computer Science, Case Western Reserve University, Cleveland, OH 44106, United States
[2] FiberLead, Inc., Cleveland, OH 44121, United States
来源：
Materials Science Forum | 2002年 / 389-393卷 / 01期
关键词：
Micromolding process - Multilayer device fabrication - PolySiC;
D O I：
10.4028/www.scientific.net/msf.389-393.755
中图分类号：
学科分类号：
摘要：
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页码：755 / 758
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