Vascular Polymer Encapsulation for Integrated Thermal Management and Packaging of Electronics

被引：0
|
作者：
Coppola, Anthony [1 ]
Fatemi, Alireza [1 ]
机构：
[1] Research and Development General Motors, Warren,MI, United States
来源：
2021 IEEE Energy Conversion Congress and Exposition, ECCE 2021 - Proceedings | 2021年
关键词：
Compendex;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Combustion - Timing circuits - Thick films - Plates (structural components) - Plate metal - Integrated circuits - Electronics packaging - Temperature control
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页码：5634 / 5641
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