Assembling technique for high-speed multilevel optical transmitter

被引：0
|
作者：
Tsunashima S. [1 ]
Tanobe H. [1 ]
Kanazawa S. [1 ]
Aratake A. [1 ]
机构：
[1] NTT Device Innovation Center, NTT Corporation, 3-1 Morinosato, Wakamiya, Atsugi, Kanagawa
来源：
| 1600年 / Japan Institute of Electronics Packaging卷 / 20期
关键词：
D O I：
10.5104/jiep.20.332
中图分类号：
学科分类号：
摘要：
[No abstract available]
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页码：332 / 335
页数：3
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