Wetting reaction of Sn-Ag based solder systems on Cu substrates plated with Au and/or Pd layer

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[1] Liu, C.Y.
[2] Li, J.
[3] Vandentop, G.J.
[4] Choi, W.J.
[5] Tu, K.N.
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Liu, C.Y. (cheng-yi.liu@intel.com) | 2001年 / Minerals, Metals and Materials Society卷 / 30期
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Number:; -9987484; Acronym:; NSF; Sponsor: National Science Foundation; -;
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