Wetting reaction of Sn-Ag based solder systems on Cu substrates plated with Au and/or Pd layer

被引：0
|
作者：
机构：
[1] Liu, C.Y.
[2] Li, J.
[3] Vandentop, G.J.
[4] Choi, W.J.
[5] Tu, K.N.
来源：
Liu, C.Y. (cheng-yi.liu@intel.com) | 2001年 / Minerals, Metals and Materials Society卷 / 30期
关键词：
Number:; -9987484; Acronym:; NSF; Sponsor: National Science Foundation; -;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [1] Wetting reaction of Sn-Ag based solder systems on Cu substrates plated with Au and/or Pd layer
    Liu, CY
    Li, J
    Vandentop, GJ
    Choi, WJ
    Tu, KN
    JOURNAL OF ELECTRONIC MATERIALS, 2001, 30 (05) : 521 - 525
  • [2] Wetting reaction of Sn-Ag based solder systems on Cu substrates plated with Au and/or Pd layer
    C. Y. Liu
    Jian Li
    G. J. Vandentop
    W. J. Choi
    K. N. Tu
    Journal of Electronic Materials, 2001, 30 : 521 - 525
  • [3] Effect of Au coating on the wettability of Cu substrate by Sn-Ag eutectic solder
    Takao, H
    Hasegawa, H
    JOURNAL OF THE JAPAN INSTITUTE OF METALS, 1999, 63 (05) : 565 - 568
  • [4] Effect of Au coating on the wettability of Cu substrate by Sn-Ag eutectic solder
    Takao, Hisaaki
    Hasegawa, Hideo
    Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, 1999, 63 (05): : 565 - 568
  • [5] Wetting and reaction of Sn-2.8Ag-0.5Cu-1.0Bi solder with Cu and Ni substrates
    Rizvi, MJ
    Chan, YC
    Bailey, C
    Lu, H
    Islam, MN
    Wu, BY
    JOURNAL OF ELECTRONIC MATERIALS, 2005, 34 (08) : 1115 - 1122
  • [6] Wetting and reaction of Sn-2.8Ag-0.5Cu-1.0Bi solder with Cu and Ni substrates
    M. J. Rizvi
    Y. C. Chan
    C. Bailey
    H. Lu
    M. N. Islam
    B. Y. Wu
    Journal of Electronic Materials, 2005, 34 : 1115 - 1122
  • [7] Wetting dynamics study of Sn-Ag solder during rreflow
    Li Song
    An Bing
    Zhang Tong-Jun
    Wu Yi-Ping
    PROCEEDINGS OF THE SEVENTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN, PACKAGING AND FAILURE ANALYSIS (HDP'05), 2005, : 203 - 206
  • [8] Influence of Pd(P) thickness on the Pd-free solder reaction between eutectic Sn-Ag alloy and Au/Pd(P)/Ni(P)/Cu multilayer
    Lee, C. Y.
    Yang, S. P.
    Yang, C. H.
    Lu, M. K.
    Kuo, T. T.
    Ho, C. E.
    SURFACE & COATINGS TECHNOLOGY, 2020, 395
  • [9] The effect of Ni on the interfacial reaction between Sn-Ag solder and Cu metallization
    Tsai, JY
    Kao, CR
    PROCEEDINGS OF THE 4TH INTERNATIONAL SYMPOSIUM ON ELECTRONIC MATERIALS AND PACKAGING, 2002, : 271 - 275
  • [10] Wetting characteristics of Sn-Ag-Cu solder on Pd-based metallic glass
    Nishikawa, Hiroshi
    WongPiromsarn, Krit
    Abe, Hiroya
    Takernoto, Tadashi
    Fukuhara, Mikio
    Wada, Takeshi
    Inoue, Akihisa
    MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS, 2008, 148 (1-3): : 124 - 127
12345