Crystal structure and colorimetric behavior of low melting point ternary alloy

被引:0
|
作者
Issa T.T. [1 ]
Majeed S.M. [2 ]
Ahmed D.S. [2 ]
机构
[1] Department of Physics, College of Science, University of Baghdad, Baghdad
[2] Applied Science Department, University of Technology, Baghdad
关键词
Bi – Sn – Cu alloy; Bi – Sn – Zn alloy; DSC; Mechanical alloying; Ternary alloy;
D O I
10.4028/www.scientific.net/MSF.1002.12
中图分类号
学科分类号
摘要
Elements of high purity (99.999) were used to prepare the alloy, Bi, Sn, Zn and Cu. Two types alloy Bi – Sn – Zn and Bi – Sn – Cu were prepared by mechanical alloying technique (MA). Annealing at 100˚Cfor 8 hours was applied for the resulting alloys. X-ray diffraction and differential scanning colorimetriy were tested for the two types of alloy before and after annealing. The best results was noticed in the ternary alloythat prepared at 4 hours milling time, and annelid at 100˚C, for 8 hours, under static air. © 2020 Trans Tech Publications Ltd, Switzerland.
引用
收藏
页码:12 / 20
页数:8
相关论文
共 50 条
  • [41] Packaging flat micro heat pipe using low melting point alloy
    Luo, Yi
    Jia, Chen
    Li, Congming
    Wang, Xiaodong
    2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, : 770 - 773
  • [42] Development of a novel composite based on polyethylene and low melting point metal alloy
    Bormashenko, E
    Sutovski, S
    Pogreb, R
    Sheshnev, A
    SMART STRUCTURES AND MATERIALS 2002: ELECTROACTIVE POLYMER ACTUATORS AND DEVICES (EAPAD), 2002, 4695 : 465 - 472
  • [43] Isotropic conductive adhesives filled with low-melting-point alloy fillers
    Lu, DQ
    Wong, CP
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2000, 23 (03): : 185 - 190
  • [44] The influence of low-melting-point alloy on the rheological properties of a polystyrene melt
    Zhang, XW
    Pan, Y
    Cheng, JF
    Yi, XS
    JOURNAL OF MATERIALS SCIENCE, 2000, 35 (18) : 4573 - 4581
  • [45] Development of conductive adhesives filled with low-melting-point alloy fillers
    Lu, DQ
    Wong, CP
    INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, PROCEEDINGS, 2000, : 7 - 13
  • [46] The depletion/wetting of the low melting point alloy in electrically conductive adhesives (ECAs)
    Wu, JL
    Moon, KS
    Wong, CP
    INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, PROCEEDINGS, 2001, : 318 - 321
  • [47] Effective regulation of thermal conductivity of polyetherimide/low-melting-point alloy composites based on the construction of segregated structure
    Shu, Mengting
    Zhang, Ping
    Han, Yazhe
    Ding, Xin
    Wang, Yanyan
    Zhang, Qian
    Gong, Yi
    Zheng, Kang
    Tian, Xingyou
    Zhang, Xian
    COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2021, 142
  • [48] Crystal structure, melting behaviour and equilibrium melting point of star polyesters with crystallisable poly (ε-caprolactone) arms
    Núñez, E
    Ferrando, C
    Malmström, E
    Claesson, H
    Werner, PE
    Gedde, UW
    POLYMER, 2004, 45 (15) : 5251 - 5263
  • [49] STRUCTURE AND BEHAVIOR OF PRECIPITATES IN A CU-SN-MG TERNARY ALLOY
    OSAMURA, K
    TAKAMUKU, S
    MURAKAMI, Y
    ZEITSCHRIFT FUR METALLKUNDE, 1976, 67 (07): : 467 - 472
  • [50] Thermal Properties Study of Low-Melting-Point-DNAN and Analysis of Solidification Behavior of High-Melting-Point-DNAN
    Shi, Danan
    Chen, Lizhen
    Wang, Jianlong
    Chen, Jun
    Pan, Hongxia
    PROPELLANTS EXPLOSIVES PYROTECHNICS, 2021, 46 (09) : 1415 - 1420