Damping properties of ductile Cu-Al-Mn-based shape memory alloys

被引：0
|
作者：
Koeda, Naoki [1 ,4 ]
Omori, Toshihiro [1 ,4 ]
Sutou, Yuji [2 ]
Suzuki, Hidekazu [3 ]
Wakita, Masami [3 ]
Kainuma, Ryosuke [1 ]
Ishida, Kiyohito [1 ]
机构：
[1] Department of Materials Science, Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan
[2] Tohoku University, Biomedical Engineering Research Organization, Sendai 980-8575, Japan
[3] Chuo Spring Co., Ltd., Research and Development Division, Miyoshi 470-0225, Japan
[4] Tohoku University
来源：
Mater. Trans. | / 1卷 / 118-122期
关键词：
Compendex;
D O I：
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学科分类号：
摘要：
Carrier mobility - Copper alloys - Damping - Dynamic mechanical analysis - Grain size and shape - Internal friction - Martensitic transformations
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