Application of two-dimensional layered hexagonal boron nitride in chip cooling

被引：0
|
作者：
Bao J. [1 ,2 ]
Zhang Y. [1 ,3 ]
Huang S. [1 ,2 ]
Sun S. [3 ]
Lu X. [1 ]
Fu Y. [3 ,4 ]
Liu J. [1 ,3 ]
机构：
[1] SMIT Center, School of Automation and Mechanical Engineering, Nanomicro Research Institute and Shanghai University, Shanghai
[2] School of Mechanical and Electrical Engineering, Huangshan University, Huangshan
[3] Department of Microtechnology and Nanoscience, Chalmers University of Technology, Kemivagen 9, Gothenburg
[4] SHT Smart High Tech AB, Gothenburg
来源：
Yingyong Jichu yu Gongcheng Kexue Xuebao/Journal of Basic Science and Engineering | 2016年 / 24卷 / 01期
关键词：
Boron nitride; Heat dissipation; Single layer; Thermal evaluation chip;
D O I：
10.16058/j.issn.1005-0930.2016.01.020
中图分类号：
学科分类号：
摘要：
Research into layered hexagonal boron nitride(h-BN)has recently intensified, due to its superior physicochemical properties compared to that of a typical two-dimensional material. H-BN can be utilized in power chips as both an insulating layer as well as a heat spreader for local hotspots with high heat flux. Single layer h-BN film grown by CVD and h-BN microparticles are respectively transferred onto the surfaces of the thermal evaluation chips, where the influence of h-BN on the heat dissipation performance of the chips can be observed at different power values. The resistance-temperature curve method and infrared thermal imager are both used to measure the temperature of hotspots on the thermal evaluation chips, which can be reduced by between 3~5℃ at 1W after the transfer of h-BN. The cooling efficiency is improved and it can be found that single layer h-BN film shows better heat dissipation ability. © 2016, The Editorial Board of Journal of Basic Science and Engineering. All right reserved.
引用
收藏
页码：210 / 217
页数：7
相关论文
共 12 条
  • [1] Fu Y., Wang T., Jonsson O., Et al., Application of through silicon via technology for in situ temperature monitoring on thermal interfaces, Journal of Micromechanics and Microengineering, 20, 2, (2010)
  • [2] Lu Y.G., Zhou Y.X., Liu J., Experimental validation of a conceptual vapor-based air-conditioning system for the reduction of chip temperature through environmental cooling in a computer closet, Journal of Basic Science and Engineering, 15, 4, pp. 531-546, (2007)
  • [3] Yan Z., Liu G., Khan J.M., Et al., Graphene quilts for thermal management of high-power GaN transistors, Nature Communications, 3, (2012)
  • [4] Gao Z., Zhang Y., Fu Y., Et al., Thermal chemical vapor deposition grown graphene heat spreader for thermal management of hot spots, Carbon, 61, pp. 342-348, (2013)
  • [5] Geim A.K., Grigorieva I.V., Van der waals heterostructures, Nature, 499, 7459, pp. 419-425, (2013)
  • [6] Kim K.K., Hsu A., Jia X., Et al., Synthesis and characterization of hexagonal boron nitride film as a dielectric layer for graphene devices, ACS Nano, 6, 10, pp. 8583-8590, (2012)
  • [7] Madakbas S., Sen F., Vezir Kahraman M., Et al., Preparation, characterization, thermal, and dielectric properties of polypyrrole/h-BN nanocomposites, Advances in Polymer Technology, (2014)
  • [8] Liu Z., Song L., Zhao S., Et al., Direct growth of graphene/hexagonal boron nitride stacked layers, Nano Letters, 11, 5, pp. 2032-2037, (2011)
  • [9] Gao G., Exfoliation on two dimentional nanosheets and composites synthesis, (2012)
  • [10] Bao J., Jeppson K., Edwards M., Et al., Synthesis and applications of two-dimensional hexagonal boron nitride in electronics manufacturing, Electronic Materials Letters, 12, 1, pp. 1-16, (2016)
12