Effects of sputtering condition on thin films deposited by r.f. sputtering with a polyimide target

Thin films were sputtered onto copper substrates with a polyimide target by a conventional r.f. sputtering apparatus. Sputtered thin films were characterized by XPS and FT-IR. Sputtering conditions, i.e., pressures and r.f. power during sputtering influenced on the elemental compositions and chemical bonding states of the thin films. Friction coefficients and wear durabilities of these sputtered thin films were evaluated by a pin-on-disk type scratch tester. Friction coefficients of the thin films were almost the same values as that of bulk material. Wear durability was improved by increase of the pressure and decrease of the r.f. power. Adhesion strengths between these thin films and copper substrates were evaluated by a pull test apparatus. Adhesion strengths between the thin films and copper substrate were also improved by increase of the pressure and decrease of the r.f. power. Shear stresses of these sputtered thin films were measured by SAICAS®Shear stresses of the sputtered thin films were improved by increase of the pressure. Contact angle of water droplets was decreased by increase the pressure and decrease the r.f. power. © 2010 The Institute of Electrical Engineers of Japan.