Optical interconnection technology for PCB applications

被引:0
|
作者
Griese, Elmar [1 ]
机构
[1] Siemens SBS, Paderborn, Germany
来源
Printed Circuit Fabrication | 2002年 / 25卷 / 06期
关键词
Electrical interconnection - Electromagnetic noise - Optoelectronic converters - Optoelectronic interconnects;
D O I
暂无
中图分类号
学科分类号
摘要
(Edited Abstract)
引用
收藏
页码:20 / 36
相关论文
共 50 条
  • [21] Optical interconnection technology for large computing and switching systems
    Dutta, NK
    COMPOUND SEMICONDUCTORS 1995, 1996, 145 : 1059 - 1062
  • [22] ULTRAVIOLET DEFINED SELECTIVE IN-DIFFUSION OF ORGANIC-DYES IN POLYIMIDE FOR APPLICATIONS IN OPTICAL INTERCONNECTION TECHNOLOGY
    CHAKRAVORTY, KK
    APPLIED PHYSICS LETTERS, 1992, 61 (10) : 1163 - 1165
  • [23] A SYSTEM-DESIGN PERSPECTIVE ON OPTICAL INTERCONNECTION TECHNOLOGY
    NORDIN, RA
    LEVI, AFJ
    AT&T TECHNICAL JOURNAL, 1993, 72 (05): : 37 - 49
  • [24] An optical interconnection technology for multilayer printed circuit boards
    Griese, E
    LEOS 2000 - IEEE ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS. 1 & 2, 2000, : 230 - 231
  • [25] Optical printed circuit board (O-PCB) as an inter-chip optical interconnection platform
    Lee, El-Hang
    2006 3rd IEEE International Conference on Group IV Photonics, 2006, : 252 - 254
  • [26] The evolution of silicon photonics as an enabling technology for optical interconnection
    Doylend, Jonathan K.
    Knights, Andrew P.
    LASER & PHOTONICS REVIEWS, 2012, 6 (04) : 504 - 525
  • [27] Optical nano monopoles for interconnection electronic chips applications
    Jassim, Daniya Amer
    Elwi, Taha A.
    OPTIK, 2022, 249
  • [28] Optical interconnection technology on the printed circuit board level: Fundamentals - Technology - Design
    Griese, Elmar
    PROCEEDINGS OF THE 2005 INTERNATIONAL STUDENTS AND YOUNG SCIENTISTS WORKSHOP PHOTONICS AND MICROSYSTEMS, 2005, : 39 - 43
  • [29] Interconnection Technology Based on InSn Solder for Flexible Display Applications
    Choi, Kwang-Seong
    Lee, Haksun
    Bae, Hyun-Cheol
    Eom, Yong-Sung
    Lee, Jin Ho
    ETRI JOURNAL, 2015, 37 (02) : 387 - 394
  • [30] Novel Interconnection Technology for Flex-on-Glass (FOG) Applications
    Lee, Haksun
    Eom, Yong-Sung
    Bae, Hyun-Cheol
    Choi, Kwang-Seong
    2013 EUROPEAN MICROELECTRONICS PACKAGING CONFERENCE (EMPC), 2013,