Effect of germanium on shearing strength and fracture surface of SnAgCu/Cu soldering joint

被引：0
|
作者：
Meng, Gongge [1 ]
Li, Caifu [2 ]
Yang, Tuoyu [3 ]
Chen, Leida [1 ]
机构：
[1] School of Material Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China
[2] Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
[3] Anhui Science and Technology University, Bengbu 233100, China
来源：
Hanjie Xuebao/Transactions of the China Welding Institution | 2008年 / 29卷 / 09期
关键词：
D O I：
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学科分类号：
摘要：
Lead-free solders
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页码：59 / 62
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