Thermal rectification in thin films driven by gradient grain microstructure

被引：0
|
作者：
机构：
[1] Cheng, Zhe
[2] Foley, Brian M.
[3] Bougher, Thomas
[4] Yates, Luke
[5] 1,Cola, Baratunde A.
[6] 1,Graham, Samuel
来源：
Cola, Baratunde A. (cola@gatech.edu) | 1600年 / American Institute of Physics Inc.卷 / 123期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [41] The effect of ultrasmall grain sizes on the thermal conductivity of nanocrystalline silicon thin films
    Jugdersuren, Battogtokh
    Kearney, Brian T.
    Culbertson, James C.
    Chervin, Christopher N.
    Katz, Michael B.
    Stroud, Rhonda M.
    Liu, Xiao
    COMMUNICATIONS PHYSICS, 2021, 4 (01)
  • [42] Determination of the thermal activation energy and grain size of iron phthalocyanine thin films
    Khrishnakumar, KP
    Menon, CS
    MATERIALS LETTERS, 2001, 48 (02) : 64 - 73
  • [43] Thermal annealing induced competition of oxidation and grain growth in nickel thin films
    Raghavan, Lisha
    Ojha, Sunil
    Sulania, Indra
    Mishra, N. C.
    Ranjith, K. M.
    Baenitz, M.
    Kanjilal, D.
    THIN SOLID FILMS, 2019, 680 : 40 - 47
  • [44] Unexpected large thermal rectification in asymmetric grain boundary of graphene
    Cao, Hai-Yuan
    Xiang, Hongjun
    Gong, Xin-Gao
    SOLID STATE COMMUNICATIONS, 2012, 152 (19) : 1807 - 1810
  • [45] SURFACE-ENERGY-DRIVEN SECONDARY GRAIN-GROWTH IN THIN AU FILMS
    WONG, CC
    SMITH, HI
    THOMPSON, CV
    APPLIED PHYSICS LETTERS, 1986, 48 (05) : 335 - 337
  • [46] Residual plastic strain recovery driven by grain boundary diffusion in nanocrystalline thin films
    Wei, Xiaoding
    Kysar, Jeffrey W.
    ACTA MATERIALIA, 2011, 59 (10) : 3937 - 3945
  • [47] SURFACE-ENERGY-DRIVEN SECONDARY GRAIN-GROWTH IN THIN SB FILMS
    CHOU, LH
    APPLIED PHYSICS LETTERS, 1991, 58 (23) : 2631 - 2633
  • [48] Microstructure of ceramic thin films
    Waser, RM
    CURRENT OPINION IN SOLID STATE & MATERIALS SCIENCE, 1996, 1 (05): : 706 - 714
  • [49] On the microstructure of TiHfOx thin films
    Domaradzki, J
    Borkowska, A
    Kaczmarek, D
    Prociów, EL
    Wasielewski, R
    Ciszewski, A
    OPTICA APPLICATA, 2005, 35 (03) : 431 - 435
  • [50] Effect of oxygen inclusion on microstructure and thermal stability of copper nitride thin films
    Du, Y.
    Huang, R.
    Song, R.
    Ma, L. B.
    Liu, C.
    Li, C. R.
    Cao, Z. X.
    JOURNAL OF MATERIALS RESEARCH, 2007, 22 (11) : 3052 - 3057
12345