The effect of water uptake on the mechanical properties of low-k organosilicate glass

被引:0
|
作者
Guo, X. [1 ]
Jakes, J.E. [2 ]
Nichols, M.T. [1 ]
Banna, S. [3 ]
Nishi, Y. [4 ]
Shohet, J.L. [1 ]
机构
[1] Plasma Processing Technology Laboratory, Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, WI 53706, United States
[2] Forest Biopolymer Science and Engineering, USDA Forest Service Forest Products Laboratory, Madison, WI 53726, United States
[3] Applied Materials, Sunnyvale, CA 94085, United States
[4] Stanford University, Stanford, CA 94305, United States
来源
Journal of Applied Physics | 2013年 / 114卷 / 08期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [1] The effect of water uptake on the mechanical properties of low-k organosilicate glass
    Guo, X.
    Jakes, J. E.
    Nichols, M. T.
    Banna, S.
    Nishi, Y.
    Shohet, J. L.
    JOURNAL OF APPLIED PHYSICS, 2013, 114 (08)
  • [2] Effect of water uptake on the fracture behavior of low-k organosilicate glass
    Guo, Xiangyu
    Jakes, Joseph E.
    Banna, Samer
    Nishi, Yoshio
    Shohet, J. Leon
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2014, 32 (03):
  • [3] The effect of He plasma treatment on properties of organosilicate glass low-k films
    Braginsky, O. V.
    Kovalev, A. S.
    Lopaev, D. V.
    Malykhin, E. M.
    Mankelevich, Yu. A.
    Proshina, O. V.
    Rakhimova, T. V.
    Rakhimov, A. T.
    Voloshin, D. G.
    Vasilieva, A. N.
    Zyryanov, S. M.
    Smirnov, E. A.
    Baklanov, M. R.
    JOURNAL OF APPLIED PHYSICS, 2011, 109 (04)
  • [4] UV curing effects on glass structure and mechanical properties of organosilicate low-k thin films
    Gage, David M.
    Guyer, Eric P.
    Stebbins, Jonathan F.
    Cui, Zhenjiang
    Al-Bayati, Amir
    Demos, Alex
    MacWilliams, Kenneth P.
    Dauskardt, Reinhold H.
    PROCEEDINGS OF THE IEEE 2006 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2006, : 149 - +
  • [5] The effect of oxygen content on bonding configuration and properties of low-k organosilicate glass dielectric film
    Chen, Sheng-Wen
    Liu, Chuan-Pu
    JangJian, Shiu-Ko
    Wang, Ying-Lang
    JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 2008, 69 (2-3) : 513 - 517
  • [6] Effects of plasma and vacuum-ultraviolet exposure on the mechanical properties of low-k porous organosilicate glass
    Guo, X.
    Jakes, J. E.
    Banna, S.
    Nishi, Y.
    Shohet, J. L.
    JOURNAL OF APPLIED PHYSICS, 2014, 116 (04)
  • [7] Plasma damage effects on low-k porous organosilicate glass
    Ren, H.
    Antonelli, G. A.
    Nishi, Y.
    Shohet, J. L.
    JOURNAL OF APPLIED PHYSICS, 2010, 108 (09)
  • [8] Eliminating dielectric degradation of low-k organosilicate glass by trimethylchlorosilane treatment
    Chang, TC
    Liu, PT
    Mor, YS
    Tsai, TM
    Chen, CW
    Mei, YJ
    Pan, FM
    Wu, WF
    Sze, SM
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2002, 20 (04): : 1561 - 1566
  • [9] Etching of organosilicate glass low-k dielectric films in halogen plasmas
    Vitale, SA
    Sawin, HH
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 2002, 20 (03): : 651 - 660
  • [10] Study on the effect of electron beam curing on low-K porous organosilicate glass (OSG) material
    Chang, TC
    Tsai, TM
    Liu, PT
    Chen, CW
    Tseng, TY
    THIN SOLID FILMS, 2004, 469 : 383 - 387