Percolation in light-cured composite resins reinforced by nanodiamonds
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作者:
Chu, Ya-Qing
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机构:
School of Mechatronical Engineering, Beijing Institute of Technology, Beijing 100081, ChinaSchool of Mechatronical Engineering, Beijing Institute of Technology, Beijing 100081, China
Chu, Ya-Qing
[1
]
Tong, Yi
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机构:
School of Mechatronical Engineering, Beijing Institute of Technology, Beijing 100081, ChinaSchool of Mechatronical Engineering, Beijing Institute of Technology, Beijing 100081, China
Tong, Yi
[1
]
Huang, Feng-Lei
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School of Mechatronical Engineering, Beijing Institute of Technology, Beijing 100081, ChinaSchool of Mechatronical Engineering, Beijing Institute of Technology, Beijing 100081, China
Huang, Feng-Lei
[1
]
Zhang, Tong-Lai
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School of Mechatronical Engineering, Beijing Institute of Technology, Beijing 100081, ChinaSchool of Mechatronical Engineering, Beijing Institute of Technology, Beijing 100081, China
Zhang, Tong-Lai
[1
]
机构:
[1] School of Mechatronical Engineering, Beijing Institute of Technology, Beijing 100081, China
Light-cured composite resins were prepared by illuminating a cylinder with a diameter of 4 mm and a length of 6 mm for 40 s, using bisphenol A ethoxylate dimethacrylate as monomer, triethyleneglycol dimethacrylate as diluting agent, camphoroquinone and dimethyaminoethyl methacrylate as photoinitiators and nanodiamonds as reinforcements. The nanodiamonds were of different size and were surface-modified by methacryloxypropyltrimethoxy silane. The flexural strength, elastic modulus and other mechanical properties of the resins were investigated to determine how the nanodiamonds influenced the properties of the composite resins. Results showed that the nanodiamonds significantly improved flexural strength and elastic modulus of the composite resins, but also decreased their depth of light-curing. A percolation phenomenon was found in the composite resins, which indicated that their mechanical properties decreased significantly when the nanodiamond content was greater than a value depending on their size.
机构:
Kyushu Univ., Research Institute for Applied Mechanics, 6-1 Kasuga-koen, Kasuga, Fukuoka, 816-8580, JapanKyushu Univ., Research Institute for Applied Mechanics, 6-1 Kasuga-koen, Kasuga, Fukuoka, 816-8580, Japan
Arakawa, Kazuo
Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A,
2012,
78
(793):
: 1377
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1381
机构:
Wuhan Univ Technol, Res Ctr Mat Genome Engn, Sch Mat Sci & Engn, Wuhan 430070, Peoples R ChinaWuhan Univ Technol, Res Ctr Mat Genome Engn, Sch Mat Sci & Engn, Wuhan 430070, Peoples R China
Li, Weideng
Wang, Kun
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机构:
Wuhan Univ, Sch Civil Engn, Dept Engn Mech, Wuhan 430072, Peoples R ChinaWuhan Univ Technol, Res Ctr Mat Genome Engn, Sch Mat Sci & Engn, Wuhan 430070, Peoples R China
Wang, Kun
Wang, Zhengzhi
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机构:
Wuhan Univ, Sch Civil Engn, Dept Engn Mech, Wuhan 430072, Peoples R ChinaWuhan Univ Technol, Res Ctr Mat Genome Engn, Sch Mat Sci & Engn, Wuhan 430070, Peoples R China
Wang, Zhengzhi
Li, Bei
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h-index: 0
机构:
Wuhan Univ Technol, Res Ctr Mat Genome Engn, Sch Mat Sci & Engn, Wuhan 430070, Peoples R China
Huazhong Univ Sci & Technol, State Key Lab Mat Proc & Die & Mould Technol, Wuhan 430073, Peoples R ChinaWuhan Univ Technol, Res Ctr Mat Genome Engn, Sch Mat Sci & Engn, Wuhan 430070, Peoples R China