Assembly technology for high-performance PCBAs

被引：0
|
作者：
Fujitsu Ltd. [1 ]
不详 [2 ]
不详 [3 ]
不详 [4 ]
机构：
来源：
Fujitsu Sci Tech J | 2007年 / 1卷 / 35-40期
关键词：
Printed circuit boards;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：35 / 40
相关论文
共 50 条
  • [21] JOSEPHSON-TECHNOLOGY - A TECHNOLOGY FOR HIGH-PERFORMANCE COMPUTING SYSTEMS
    MATISOO, J
    JAPANESE JOURNAL OF APPLIED PHYSICS, 1982, 21 (01) : 311 - 311
  • [22] Vale: Verifying High-Performance Cryptographic Assembly Code
    Bond, Barry
    Hawblitzel, Chris
    Kapritsos, Manos
    Leino, K. Rustan M.
    Lorch, Jacob R.
    Parno, Bryan
    Rane, Ashay
    Setty, Srinath
    Thompson, Laure
    PROCEEDINGS OF THE 26TH USENIX SECURITY SYMPOSIUM (USENIX SECURITY '17), 2017, : 917 - 934
  • [23] COMPUTER-ASSISTED ASSEMBLY OF HIGH-PERFORMANCE OBJECTIVES
    GUYENOT, V
    F&M-FEINWERKTECHNIK & MESSTECHNIK, 1990, 98 (09): : 361 - 363
  • [24] Design for Assembly Guidelines for High-Performance Compliant Mechanisms
    Gandhi, Prasanna
    Sonawale, Kaustubh
    Soni, Vaibhav
    Patanwala, Naved
    Bansode, Arvind
    JOURNAL OF MECHANICAL DESIGN, 2012, 134 (12)
  • [25] AN UPDATE ON ELECTROPHORESIS - INTRODUCTION - HIGH-PERFORMANCE TECHNOLOGY
    PELTRE, G
    ANALUSIS, 1989, 17 (08) : P27 - P28
  • [26] HIGH-PERFORMANCE OPTICAL DATALINK ARRAY TECHNOLOGY
    NORDIN, RA
    BUCHHOLZ, DB
    HUISMAN, RF
    BASAVANHALLY, NR
    LEVI, AFJ
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1993, 16 (08): : 783 - 788
  • [27] THERMOPLASTIC PREPREG TECHNOLOGY FOR HIGH-PERFORMANCE COMPOSITES
    CLEMANS, S
    HARTNESS, T
    SAMPE QUARTERLY-SOCIETY FOR THE ADVANCEMENT OF MATERIAL AND PROCESS ENGINEERING, 1989, 20 (04): : 38 - 42
  • [28] ON THE STATUS OF THE MANUFACTURING TECHNOLOGY FOR HIGH-PERFORMANCE COMPOSITES
    HILLE, EA
    KUNSTSTOFFE-GERMAN PLASTICS, 1984, 74 (01): : 17 - 18
  • [29] UNIVERSITIES AND THE FUTURE OF HIGH-PERFORMANCE COMPUTING TECHNOLOGY
    WILSON, KG
    AFIPS CONFERENCE PROCEEDINGS, 1983, 52 : 469 - &
  • [30] High-performance thermal interface technology overview
    Linderman, R.
    Brunschwiler, T.
    Smith, B.
    Michel, B.
    13TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATION OF ICS AND SYSTEMS, PROCEEDINGS, 2007, : 129 - 134
12345