Growth kinetics of the Cu3Sn phase and void formation of sub-micrometre solder layers in Sn-Cu binary and Cu-Sn-Cu sandwich structures

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作者：
Li, Qingqian [1 ]
Chan, Y.C. [1 ]
机构：
[1] Department of Electronic Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon Tong, Kowloon, Hong Kong
来源：
Journal of Alloys and Compounds | 2013年 / 567卷
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页码：47 / 53
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