Quick assessment methodology for reliability of solder joints in ball grid array (BGA) assembly-part II: Reliability experiment and numerical simulation

被引：0
|
作者：
Shi, Xunqing [1 ]
Pang, John H.L. [2 ]
Yang, Qianjin [2 ]
Wang, Zhiping [2 ]
Nie, Jingxu [1 ]
机构：
[1] Dept. of Power Eng., Beijing Univ. of Aero. and Astron., Beijing 100083, China
[2] Sch. of Mech. and Prod. Eng., Nanyang Technol. Univ., Nanyang Avenue, Singapore 639798, Singapore
来源：
Acta Mechanica Sinica/Lixue Xuebao | 2002年 / 18卷 / 04期
关键词：
Received; 4; December; 2000; revised 11 May 2001 * The project supported by the National Natural Science Foundation of China (59705008);
D O I：
10.1007/bf02487788
中图分类号：
学科分类号：
摘要：
18
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收藏
页码：356 / 367
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