Influencing factors of lead-free laser soldering speed

被引:0
|
作者
Shi W. [1 ,2 ]
Yang Y. [1 ]
Huang Y. [1 ]
机构
[1] School of Mechanical and Automotive Engineering, South China University of Technology
[2] College of Science, Guangdong Ocean University
关键词
Laser soldering speed; Laser technology; Lead-free laser soldering;
D O I
10.3788/HPLPB20102207.1525
中图分类号
学科分类号
摘要
In order to increase the lead-free laser soldering speed, the laser parameters, properties of solder and substrate, laser soldering system and other influencing factors of the lead-free laser soldering are studied. The research shows that once the laser, the solder and the substrate are given, a laser soldering system equipped with two galvanometer scanners and an f-theta lens has obvious advantages in soldering speed as compared with the traditional laser soldering system with moving worktable or laser head, because the reflection of the laser beam through the scanning galvanometers overcomes the restriction of the mechanical inertia of the laser head and worktable. In addition, the path that laser beam has scanned in the process of soldering is optimized. The optimization can greatly shorten the total scanning distance and improve the soldering speed without any additional hardware cost.
引用
收藏
页码:1525 / 1530
页数:5
相关论文
共 50 条
  • [31] Developments in lead-free solders and soldering technology
    Kang, SK
    JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY, 2002, 54 (06): : 25 - 25
  • [32] Development of lead-free wave soldering process
    Arra, M
    Shangguan, D
    Yi, S
    Thalhammer, R
    Fockenberger, H
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2002, 25 (04): : 289 - 299
  • [33] Nitrogen in reflow soldering of lead-free solders
    Belyakov, Sergey A.
    EDM 2007: 8TH INTERNATIONAL WORKSHOP AND TUTORIALS ON ELECTRON DEVICES AND MATERIALS, 2007, : 84 - 85
  • [34] Five steps to success in lead-free soldering
    Martel, Mike
    EP Electronic Production (London), 2002, 31 (04):
  • [35] Assessing the environmental implications of lead-free soldering
    Turbini, LJ
    Munie, GC
    Bernier, D
    Gamalski, J
    Bergman, DW
    ELECTRONICS GOES GREEN 2000 (PLUS): A CHALLENGE FOR THE NEXT MILLENNIUM, VOL 1, PROCEEDINGS, 2000, : 37 - 42
  • [36] Role of intermetallic compounds in lead-free soldering
    Harris, Paul G.
    Chaggar, Kaldev S.
    Soldering and Surface Mount Technology, 1998, (30): : 38 - 52
  • [37] Lead-free reflow soldering for electronics assembly
    Harrison, MR
    Vincent, JH
    Steen, HAH
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2001, 13 (03) : 21 - 38
  • [38] Five steps to successful lead-free soldering
    Barbini, D.
    Diepstraten, G.
    Circuits Assembly, 2001, 12 (04):
  • [39] Silver nanosintering: a lead-free alternative to soldering
    Maruyama, Minoru
    Matsubayashi, Ryo
    Iwakuro, Hiroaki
    Isoda, Seiji
    Komatsu, Teruo
    APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2008, 93 (02): : 467 - 470
  • [40] Electrochemical migration on lead-free soldering of Pcbs
    Mendes, Luiz Tadeu Freire
    Cardoso, Valtemar Fernandes
    Da Silva, Ana Neilde Rodrigues
    ECS Transactions, 2009, 23 (01) : 271 - 278